{"id":619859,"date":"2021-05-27T12:00:51","date_gmt":"2021-05-27T10:00:51","guid":{"rendered":"https:\/\/www.tomshardware.fr\/?p=619859"},"modified":"2023-07-15T12:42:30","modified_gmt":"2023-07-15T10:42:30","slug":"cooler-master-et-murata-elaborent-une-chambre-a-vapeur-de-seulement-200-micrometres","status":"publish","type":"post","link":"https:\/\/www.tomshardware.fr\/cooler-master-et-murata-elaborent-une-chambre-a-vapeur-de-seulement-200-micrometres\/","title":{"rendered":"Cooler Master et Murata \u00e9laborent une chambre \u00e0 vapeur de seulement 200 microm\u00e8tres"},"content":{"rendered":"\n

Cooler Master avait d\u00e9j\u00e0 \u00e0 son actif un ventirad dot\u00e9 d’une chambre \u00e0 vapeur horizontale\u00a0; l\u2019entreprise ta\u00efwanaise d\u00e9veloppe actuellement, en partenariat avec Murata, la plus petite chambre \u00e0 vapeur du monde. Celle-ci a une \u00e9paisseur de seulement 200 microm\u00e8tres (\u00b5m). Selon le communiqu\u00e9, il s\u2019agit “du dissipateur de chaleur le plus fin au monde pour les appareils \u00e9lectroniques”<\/em>. Pour la comparaison, un cheveux humain a un diam\u00e8tre qui varie entre 60 \u00e0 110 microm\u00e8tres environ.<\/p>\n\n\n\n

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Cooler Master et Murata d\u00e9crivent<\/a> la structure d’une chambre \u00e0 vapeur ainsi\u00a0: “Un liquide de refroidissement (fluide de fonctionnement), est enferm\u00e9 entre les couches de chevauchement de feuille de m\u00e9tal mince. Le fluide de fonctionnement absorbe la chaleur de la source de chaleur, ce qui entra\u00eene son \u00e9vaporation, et cette vapeur est ensuite dispers\u00e9e dans la chambre \u00e0 vapeur, entra\u00eenant de cette mani\u00e8re la dissipation de la chaleur. Au fur et \u00e0 mesure que la chaleur se dissipe, la vapeur se condense \u00e0 nouveau en liquide pour \u00eatre renvoy\u00e9e \u00e0 la source de chaleur par une m\u00e8che contenant des intervalles minuscules.”<\/em><\/p>\n\n\n\n

Pour refroidir ses serveurs, Microsoft teste le \u2018liquide bouillant\u2019<\/a><\/strong><\/p>\n\n\n\n

La demande de chambres \u00e0 vapeur en forte hausse<\/h2>\n\n\n\n

Comme l\u2019expliquent les deux entreprises, “dans la mesure o\u00f9 les dispositifs \u00e9lectroniques atteignent des performances plus \u00e9lev\u00e9es et des fonctionnalit\u00e9s plus avanc\u00e9es, la quantit\u00e9 de chaleur g\u00e9n\u00e9r\u00e9e par ces dispositifs augmente, ce qui produit un probl\u00e8me cl\u00e9 de dispersion et de dissipation efficace de la chaleur, ainsi que de refroidissement. De plus, l’espace limit\u00e9 disponible \u00e0 l’int\u00e9rieur du bo\u00eetier du produit de conception \u00e0 haute densit\u00e9 signifie que les composants conventionnels de dispersion de chaleur tels que les feuilles de graphite et les caloducs ne peuvent pas fournir une dissipation de chaleur suffisante.<\/em><\/p>\n\n\n\n

C’est pour cette raison qu’un besoin en chambres \u00e0 vapeur, qui peuvent<\/em> disperser la chaleur sur une grande surface et dissiper la chaleur efficacement en d\u00e9pit de l’espace limit\u00e9, s’est fait sentir. L’espace disponible pour les dissipateurs de chaleur est particuli\u00e8rement limit\u00e9 dans les produits mobiles dot\u00e9s de fonctionnalit\u00e9s avanc\u00e9es, tels que les smartphones 5G et les appareils AR et VR, car ils utilisent des circuits int\u00e9gr\u00e9s de haute performance et font face \u00e0 une demande constante pour un poids r\u00e9duit.”<\/em><\/p>\n\n\n\n

Les smartphones 5G font chauffer la demande de chambres \u00e0 vapeur<\/a><\/strong><\/p>\n\n\n\n

Selon elles, cette chambre \u00e0 vapeur peut \u00eatre mont\u00e9e “dans de tr\u00e8s petits espaces int\u00e9rieurs tout en assurant une dispersion et une dissipation efficaces de la chaleur provenant de composants tels que les CI, am\u00e9liorant ainsi la stabilit\u00e9 de fonctionnement des appareils \u00e9lectroniques compacts”<\/em>.<\/p>\n\n\n\n

Restera maintenant \u00e0 d\u00e9couvrir les performances de dissipation thermique de cette chambre \u00e0 vapeur de 200 \u03bcm. Cooler Master assurera sa fabrication dans ses usines. Les phases de test devraient se terminer d\u2019ici la fin d\u2019ann\u00e9e. Par cons\u00e9quent, cette chambre \u00e0 vapeur pourrait int\u00e9grer des smartphones lanc\u00e9s en 2022 ou 2023.<\/p>\n","protected":false},"excerpt":{"rendered":"

Pr\u00e9sent\u00e9e comme \"le dissipateur de chaleur le plus fin au monde destin\u00e9 aux appareils \u00e9lectroniques\".<\/p>","protected":false},"author":87,"featured_media":619862,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[487,4110,4078],"tags":[661],"hubs":[],"class_list":["post-619859","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-actualite","category-r-d","category-refroidissement","tag-cooler-master"],"acf":{"display_mode":"medium-img","post_show_excerpt":true,"post_source":"","hide_sidebar":false,"hide_advertising":false},"yoast_head":"\nCooler Master et Murata \u00e9laborent une chambre \u00e0 vapeur de seulement 200 microm\u00e8tres<\/title>\n<meta name=\"description\" content=\"Pr\u00e9sent\u00e9e comme "le dissipateur de chaleur le plus fin au monde destin\u00e9 aux appareils \u00e9lectroniques".\" \/>\n<meta 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Alors devant une carte Voodoo, j'aurais certainement la m\u00eame attitude qu'un singe devant une \u0153uvre d'art. Pour finir, je le confesse, je pr\u00e9f\u00e8re Fallout 4 \u00e0 Fallout, Doom 2016 \u00e0 Doom, Civilization VI \u00e0 Civilization, eFootball \u00e0 PE... non, l\u00e0, faut tout de m\u00eame pas d\u00e9conner.","sameAs":["www.linkedin.com\/in\/r\u00e9mi-bouvet-96049a151"],"honorificPrefix":"Sieur","gender":"Homme","knowsLanguage":["Fran\u00e7ais","Anglais","Burgonde"],"jobTitle":"R\u00e9dacteur","worksFor":"Galaxie Media","url":"https:\/\/www.tomshardware.fr\/author\/remi\/"}]}},"_links":{"self":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/posts\/619859"}],"collection":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/users\/87"}],"replies":[{"embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/comments?post=619859"}],"version-history":[{"count":0,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/posts\/619859\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/media\/619862"}],"wp:attachment":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/media?parent=619859"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/categories?post=619859"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/tags?post=619859"},{"taxonomy":"hubs","embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/hubs?post=619859"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}