{"id":754389,"date":"2022-12-31T09:00:00","date_gmt":"2022-12-31T08:00:00","guid":{"rendered":"https:\/\/www.tomshardware.fr\/?p=754389"},"modified":"2023-06-22T16:27:28","modified_gmt":"2023-06-22T14:27:28","slug":"tsmc-celebre-lexpansion-de-la-fab-18-et-le-debut-de-la-production-en-volume-en-3-nm","status":"publish","type":"post","link":"https:\/\/www.tomshardware.fr\/tsmc-celebre-lexpansion-de-la-fab-18-et-le-debut-de-la-production-en-volume-en-3-nm\/","title":{"rendered":"TSMC c\u00e9l\u00e8bre l’expansion de la Fab 18 et le d\u00e9but de la production en volume en 3 nm"},"content":{"rendered":"\n

Le 29 d\u00e9cembre, TSMC a organis\u00e9 une c\u00e9r\u00e9monie pour c\u00e9l\u00e9brer le d\u00e9but de la production en volume et l’extension de ses capacit\u00e9 en 3 nanom\u00e8tres<\/a> dans sa nouvelle Fab 18 situ\u00e9e dans le parc scientifique du sud de Ta\u00efwan (STSP). Le fondeur rapporte “une production en volume avec de bons rendements” ; il estime “que la technologie 3 nm permettra de cr\u00e9er des produits finis d’une valeur marchande de 1,5 billion de dollars am\u00e9ricains dans les cinq ann\u00e9es \u00e0 venir”.<\/p>\n\n\n

\n
\"Image<\/a>
\u00a9 TSMC<\/figcaption><\/figure><\/div>\n\n\n

Cette usine contient une salle blanche d\u2019une surface de 58 000 m\u00e8tres carr\u00e9s, ce qui est environ “le double de la taille d’une fabrique de circuits logiques standard” selon TSMC. Elle va contribuer \u00e0 la cr\u00e9ation de 23 500 emplois, dont 11 300 emplois directs dans le domaine de la haute technologie. Outre cette expansion des capacit\u00e9s 3 nm \u00e0 Taiwan, TSMC construit \u00e9galement une usine consacr\u00e9e au 3 nm aux \u00c9tats-Unis, dans l\u2019Arizona<\/a>.<\/p>\n\n\n\n

TSMC d\u00e9voile sa feuille de route jusqu\u2019en 2025 : cap sur le 2 nm<\/a><\/strong><\/p>\n\n\n\n

Un nouveau centre mondial de R&D<\/h2>\n\n\n\n

TSMC a \u00e9galement annonc\u00e9 que son nouveau centre mondial de R&D, situ\u00e9 dans le parc scientifique de Hsinchu, ouvrira officiellement ses portes au deuxi\u00e8me trimestre de 2023 et comptera 8 000 employ\u00e9s.<\/p>\n\n\n\n

TSMC pr\u00e9pare \u00e9galement ses usines de fabrication de 2 nm, qui seront situ\u00e9es dans les parcs scientifiques de Hsinchu et du centre de Taiwan, avec un total de six phases, lesquelles “se d\u00e9roulent comme pr\u00e9vu”.<\/p>\n\n\n\n

Mark Liu, pr\u00e9sident de TSMC, a pr\u00e9sid\u00e9 la c\u00e9r\u00e9monie. Parmi les invit\u00e9s de marque, citons le vice-premier ministre Shen Jong-chin, le ministre des Affaires \u00e9conomiques Wang Mei-hua, ainsi que le ministre des Sciences et de la Technologie Wu Tsung-tsong.<\/p>\n\n\n\n

Innovation et environnement<\/h2>\n\n\n\n

Dans son communiqu\u00e9, le fondeur met en avant deux aspects : le respect de l\u2019environnement et les avanc\u00e9es qu’apporte le 3 nm.<\/p>\n\n\n\n

Concernant le premier, le fondeur assure que tous ses sites STSP “respectent les normes de certification de construction \u00e9cologique EEWH de Taiwan et LEED des \u00c9tats-Unis”. En outre, “les installations utiliseront les ressources en eau de l’usine de recyclage des eaux de TSMC STSP pour atteindre progressivement l’objectif de l’entreprise d’utiliser 60 % d’eau recycl\u00e9e d’ici 2030”. Enfin, “lorsque la production en volume commencera, la Fab 18 utilisera 20 % d’\u00e9nergie renouvelable [\u2026]”.<\/p>\n\n\n\n

Au sujet du processus 3 nm, TSMC argue que c\u2019est la “technologie de semi-conducteurs la plus avanc\u00e9e en termes de puissance, de performance et de densit\u00e9”. Concr\u00e8tement, par rapport au processus 5 nm (N5), le 3 nm du fondeur am\u00e9liore jusqu’\u00e0 1,6X la densit\u00e9 logique et offre une r\u00e9duction de consommation de 30-35 % \u00e0 fr\u00e9quence identique.<\/p>\n\n\n\n

Source : TSMC<\/a><\/em><\/p>\n","protected":false},"excerpt":{"rendered":"

Une c\u00e9r\u00e9monie pour une usine situ\u00e9e \u00e0 Ta\u00efwan, o\u00f9 \u00e9taient notamment convi\u00e9s le vice-premier ministre Shen Jong-chin, le ministre des Affaires \u00e9conomiques Wang Mei-hua, ainsi que le ministre des Sciences et de la Technologie Wu\u2026<\/p>","protected":false},"author":87,"featured_media":754390,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[487,4068],"tags":[],"hubs":[],"class_list":["post-754389","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-actualite","category-informatique"],"acf":{"display_mode":"medium-img","post_show_excerpt":true,"post_show_in_home":false,"post_source":"","hide_sidebar":false,"hide_advertising":false},"yoast_head":"\nTSMC c\u00e9l\u00e8bre l'expansion de la Fab 18 et le d\u00e9but de la production en volume en 3 nm<\/title>\n<meta name=\"description\" content=\"Une 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Pour finir, je le confesse, je pr\u00e9f\u00e8re Fallout 4 \u00e0 Fallout, Doom 2016 \u00e0 Doom, Civilization VI \u00e0 Civilization, eFootball \u00e0 PE... non, l\u00e0, faut tout de m\u00eame pas d\u00e9conner.","sameAs":["www.linkedin.com\/in\/r\u00e9mi-bouvet-96049a151"],"honorificPrefix":"Sieur","gender":"Homme","knowsLanguage":["Fran\u00e7ais","Anglais","Burgonde"],"jobTitle":"R\u00e9dacteur","worksFor":"Galaxie Media","url":"https:\/\/www.tomshardware.fr\/author\/remi\/"}]}},"_links":{"self":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/posts\/754389"}],"collection":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/users\/87"}],"replies":[{"embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/comments?post=754389"}],"version-history":[{"count":0,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/posts\/754389\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/media\/754390"}],"wp:attachment":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/media?parent=754389"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/categories?post=754389"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/tags?post=754389"},{"taxonomy":"hubs","embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/hubs?post=754389"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}